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HARDWARE

G.Skill DDR3 SDRAM 32GB Review (Part 3)

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G.Skill RipjawsZ F3-2133C9Q-32GZH

The G.Skill RipjawsZ represents further revolution of the RipjawsX series that we have discussed above. The first Ropjaws kits were marketed as quad-channel memory for LGA2011 platforms but ultimately, this name was applied to the specific shape of the radiators and the RipjawsZ was also positioned as dual-channel memory for LGA1155 platforms as well. The F3-2133C9Q-32GZH illustrates this revolution. It was originally meant for X79-based mainboards but the compatibility list was expanded after the release of Ivy Bridge CPUs and now includes many Z77-based mainboards.

The RipjawsZ F3-2133C9Q-32GZH is transported in an plastic blister wrap, like other memory kits from G.Skill.

G.Skill RipjawsZ F3-2133C9Q-32GZH

G.Skill RipjawsZ F3-2133C9Q-32GZH

Now, let’s take a look at their exterior design. Their radiators are different from other radiators of the RipjawsX modules. They are still made ​​of aluminum but the color is switched into glossy black. Furthermore, the radiators have become somewhat more solid, yet the RipjawsZ modules are still not too tall and are not likely to conflict with massive air coolers for CPUs. The full height of each module is 40mm, exactly as that of the RipjawsX series.

The radiators are still made of aluminum but the color is changed into glossy black

The radiators are still made of aluminum but the color is changed into glossy black

We have no doubts about the cooling performance of the RipjawsZ radiators. The modules are not as hot as their cousins, while the radiators are shaped sophisticatedly to enlarge the total heat dissipation area.

The radiators are fixed on the memory chips with a gluey thermal interface material. Below them, we can find a specific BrainPower PCB of G.Skill products and specially selected 4-gigabit DDR3 SDRAM chips from Samsung. The components have a good overclocking reputation. The B83U854 1.00 PCB is optimized for clock rates above 2 GHz while the SEC HCH9 chips are perhaps the most popular choice for high-speed overclocker-friendly DDR3 SDRAM.

We can find selected 4-gigabit DDR3 SDRAM chips from Samsung below the heatsinks

We can find selected 4-gigabit DDR3 SDRAM chips from Samsung below the heatsinks

The G.Skill RipjawsZ F3-2133C9Q-32GZH kit looks good in all aspects, including its specifications. Its four 8GB modules can work in DDR3-2133 mode which is not covered by the official specifications of CPU-integrated memory controllers.

The RipjawsZ F3-2133C9Q-32GZH had a slightly higher default voltage but can work at CL9. This is reflected in the duplicated XMP profiles:

The duplicated XMP profiles

The duplicated XMP profiles

This DDR3-2133 SDRAM kit is a true overclocker-friendly product whose rated mode is beyond normal standards. It undergoes presale testing and comes with a lifetime warranty, but G.Skill guarantees its stable operation with only a limited number of mainboards mostly include top models from ASUS, Gigabyte and MSI based on Intel's Z77 chipset.

Specifications

·         32 GB dual-channel kit consists of four memory modules, 8 GB each

·         Nominal frequency: 2,133 MHz

·         Timings: 9-11-11-31-2T

·         Supports XMP

·         Voltage: 1.6 V

G.Skill TridentX F3-2400C10Q-32GTX

G.Skill’s top overclocker-friendly products are marketed under TridentX trademark. In addition to extreme specifications and a special version of aluminum heatsinks, this series are different from other DDR3 SDRAM in some more ways. The TridentX series was launched with the Intel Z77 platform, its visiting card being the transformer heatsinks that can change their size and appearance.

Including four 8GB modules of DDR3-2400 SDRAM, the G.Skill TridentX F3-2400C10Q-32GTX has the same packaging as other G.Skill products. It is shipped in a dual-sided blister wrap.

G.Skill TridentX F3-2400C10Q-32GTX

G.Skill TridentX F3-2400C10Q-32GTX

The radiators of the TridentX series are completely different from other solutions from G.Skill. neatly produced, they are pretty heavy though they are made of aluminum. The bottom of each radiator that covers the DDR3 SDRAM chips is a pair of thick black bars with a textured surface. The top is a red aluminum superstructure with a complex configuration styled as tongues of flame.

The radiators of this TridentX series are completely different

The radiators of this TridentX series are completely different

It is not the impressive appearance but the transformability that is the main feature of these radiators. G.Skill listened to complaints from users that tall heatsinks had low compatibility with massive CPU coolers, so the top (red) part of the heatsink can be removed by unfastening two screws. As a result, the total height of a TridentX module is dropped from 54 to 40mm, allowing selecting between aesthetics and practicality. In their shortened version, the TridentX modules will not conflict with normal large-size CPU coolers.

The top (red) part of the heatsink can be removed by unfastening two screws

The top (red) part of the heatsink can be removed by unfastening two screws

The shortened radiator is quite effective to cool the eight memory chips on both sides of each module. The G.Skill TridentX F3-2400C10Q-32GTX modules are not very hot as they are based on 30nm DDR3 SDRAM chips. The maximum temperatures we spotted during the test was over 53°C.

Rated for 2400 MHz, these modules have the same parts as the 2133MHz RipjawsZ F3-2133C9Q-32GHZ. Therefore, it is all about choosing the best chips. The TridentX uses the same SEC HCH9 components but from a different batch. Thanks to the high overclocking potential and low heat dissipation, these chips have a good reputation and are widely used in high-speed memory modules. Again, the PCB is produced by BrainPower. Each 8GB module has a total of 16 chips, 4-gigabit in capacity each.

The PCB is produced by BrainPower

The PCB is produced by BrainPower

The voltage is increased to the maximum limit allowed for Intel’s DDR3 SDRAM controllers, which is normal for high-speed memory. The good news is that the TridentX F3-2400C10Q-32GTX features rather low timings. That's especially good considering that it is a four-piece memory kit.

The high clock rate and CL10 timings narrow the range of compatible mainboards. G.Skill guarantees the TridentX F3-2400C10Q-32GTX will operate with about 2 dozen Z77-based mainboards from ASUS, Gigabyte and MSI, but we guess that there won’t be problems with many other products. To simplify installation, these modules support XMP 1.3. The single XMP configuration (it is duplicated for more stability) contains the same clock rate, voltage and timings as you can see in the official specifications. Considering that the Ivy Bridge memory controller is flexible and easy to configure, releasing this memory at 2,400 MHz won’t be a problem at all. You will not have to do any setting up for this memory kit but their SPD unit contains DDR3-1333 settings just in case.

The single XMP configuration contains the same clock rate, voltage and timings

The single XMP configuration contains the same clock rate, voltage and timings

All TridentX F3-2400C10Q-32GTX modules under presale testing at the manufacturer’s facilities and comes with a lifetime warranty.

Specifications

·         32 GB Dual-channel kit consists of four memory modules, 8 GB each

·         Nominal frequency: 2,400 MHz

·         Timings: 10-12-12-31-2T

·         Supports XMP

·         Voltage: 1.65 V

 

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